G537A
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Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -40 ~ 85℃
Compact Package Design for PCB Applications -
Size Display
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Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXG537A[2620-2690]MHz 2.620 2.690 2.6550 0.070 23 0.25 1.15 150 - G537A[2400-2500]MHz 2.400 2.500 2.4500 0.100 23 0.25 1.15 100 - G537A[2110-2170]MHz 2.110 2.170 2.1400 0.060 23 0.25 1.15 150 - G537A[2010-2025]MHz 2.010 2.025 2.0175 0.015 23 0.25 1.15 100 - G537A[1920-1980]MHz 1.920 1.980 1.9500 0.060 23 0.25 1.15 150 - G537A[1805-1920]MHz 1.805 1.920 1.8625 0.115 22 0.25 1.17 100 - G537A[1805-1880]MHz 1.805 1.880 1.8375 0.075 23 0.25 1.15 100 - G537A[1710-1755]MHz 1.710 1.755 1.7325 0.045 25 0.25 1.15 150 - G537A[1452-1492]MHz 1.452 1.492 1.4720 0.040 25 0.25 1.15 100 - G537A[920-960]MHz 0.920 0.960 0.9400 0.040 23 0.3 1.15 100 - G537A[880-920]MHz 0.880 0.920 0.9000 0.040 23 0.3 1.15 150 - G537A[869-894]MHz 0.869 0.894 0.8815 0.025 23 0.3 1.15 150 - G537A[865-880]MHz 0.865 0.880 0.873 0.015 23 0.3 1.15 150 - G537A[851-866]MHz 0.851 0.866 0.859 0.015 25 0.25 1.15 150 -
