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H504B

• Product Features

  UMTS, LTE Band
  PCB Soldering Re-flow
  Wide Operation Temperature Range -40 ~ 125℃
  Compact Package Design for PCB Applications

• Size Display

  

• Specification Parameters

  Model		Frequency（GHz） F1	Frequency（GHz） F2	Center Frequency (GHz)	Bandwidth （GHz）	Isolation （dB）MIN	INS LOSS （dB）MAXen	VSWR MAX	Power (W)	IMD (@2X43dBm) (-dBc)MAX
  H504B3.5[2110-2170]MHz											2.110	2.170	2.1400	0.060	25	0.2	1.12	250	-75
  H504B3.0[2110-2170]MHz		2.110	2.170	2.1400	0.060	25	0.2	1.12	250	-75
  H504B3.5[1795-1890]MHz		1.795	1.890	1.8425	0.095	25	0.2	1.12	250	-75
  H504B3.0[1795-1890]MHz		1.795	1.890	1.8425	0.095	25	0.2	1.12	250	-75
  H504B3.5[925-960]MHz		0.925	0.960	0.9425	0.035	25	0.2	1.12	250	-75
  H504B3.0[925-960]MHz		0.925	0.960	0.9425	0.035	25	0.2	1.12	250	-75
  H504B3.0[850-900]MHz		0.850	0.900	0.8750	0.050	25	0.2	1.12	250	-72
  H504B3.5[850-900]MHz		0.850	0.900	0.8750	0.050	25	0.2	1.12	250	-70