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H531B

• Product Features

  UMTS, LTE Band
  PCB Soldering Re-flow
  Wide Operation Temperature Range -40 ~ 85℃
  Compact Package Design for PCB Applications

• Size Display

  

• Specification Parameters

  Model		Frequency（GHz） F1	Frequency（GHz） F2	Center Frequency (GHz)	Bandwidth （GHz）	Isolation （dB）MIN	INS LOSS （dB）MAXen	VSWR MAX	Power (W)	IMD (@2X43dBm) (-dBc)MAX
  H531B[2550-2650]MHz											2.550	2.650	2.600	0.100	23	0.3	1.15	100	-
  H531B[2400-2500]MHz		2.400	2.500	2.450	0.100	23	0.3	1.15	100	-
  H531B[2300-2400]MHz		2.300	2.400	2.350	0.100	23	0.3	1.15	100	-
  H531B[2110-2170]MHz		2.110	2.170	2.140	0.060	23	0.3	1.15	100	-
  H531B[1930-1995]MHz		1.930	1.995	1.963	0.065	23	0.3	1.15	100	-
  H531B[1805-2025]MHz		1.805	2.025	1.915	0.220	18	0.35	1.28	75	-
  H531B[1880-1920]MHz		1.880	1.920	1.900	0.040	23	0.3	1.15	100	-
  H531B[930-960]MHz		0.930	0.960	0.9450	0.030	21	0.45	1.2	50	-
  H531B[865-880]MHz		0.865	0.880	0.8725	0.015	21	0.45	1.2	50	-
  H531B[851-866]MHz		0.851	0.866	0.8585	0.015	21	0.45	1.2	50	-