H102B
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Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -45 ~ 125℃
Compact Package Design for PCB Applications -
Size Display
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Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXHYH102BF0.0(2620-2690)MHz 2.620 2.690 2.655 0.070 23 0.25 1.15 100 -65 HYH102BZ0.0(2496-2690)MHz 2.496 2.690 2.593 0.194 25 0.28 1.12 100 -65 HYH102BF0.0(2300-2400)MHz 2.300 2.400 2.350 0.100 23 0.25 1.15 100 -65 HYH102BZ0.0(2110-2170)MHz 2.110 2.170 2.140 0.060 23 0.25 1.15 100 -65 HYH102BF0.0(1930-1995)MHz 1.930 1.995 1.963 0.065 25 0.25 1.12 100 -65 HYH102BF0.0 (1880-2025)MHZ 1.880 2.025 1.953 0.145 25 0.28 0.12 100 -65 HYH102BZ0.0(1805-1880)MHz 1.805 1.880 1.843 0.075 23 0.25 1.15 100 -65 HYH102BF0.0(1800-2200)MHz 1.800 2.200 2.000 0.400 20 0.3 1.22 100 -65 HYH102BF0.0(1525-1626)MHz 1.525 1.626 1.576 0.101 22 0.28 1.17 100 -65 HYH102BF0.0(1417-1540)MHz 1.417 1.540 1.479 0.123 23 0.25 1.15 100 -65
